Multimodal Sensing Integration in Electronic Skin: The Synergistic Evolution of Materials, Structures, and Algorithms
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DOI: 10.25236/iwmecs.2025.015
Author(s)
Zhentao Zhang, Hanwen Zhang, Binrui Zhao, Zhehao Zheng
Corresponding Author
Zhentao Zhang
Abstract
Electronic skin (e-skin) serves as a crucial sensory interface linking intelligent systems with the external environment. Recent progress has shifted its development from single-modality sensors toward integrated multimodal systems capable of perceiving complex stimuli with high sensitivity and adaptability. This review highlights advances across three core dimensions—materials, structures, and fusion mechanisms. Material innovations have evolved from simple conductive layers to multifunctional and recyclable composites; structural designs have progressed from planar arrays to biomimetic microstructures and 3D interlocking architectures; and multimodal fusion has advanced from signal stacking to intelligent decoupling and in-sensor computing. Despite these advances, challenges remain in stability, scalability, and low-power integration. Future efforts should focus on synergizing materials, structures, and algorithms to develop self-healing, energy-efficient, and adaptive e-skin systems capable of evolving from passive sensors to intelligent, human-like perceptual interfaces.
Keywords
Electronic skin, Multimodal sensing, Flexible materials, Biomimetic structures, Signal decoupling, Near-sensor computing, Neuromorphic devices